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High Temperature Electronics (HTE)

A number of applications today require electronics to operate in extremely harsh environment conditions. Operation temperature of 150°C and higher are required for energy exploration as well as other emerging applications such as geophysical services, avionics and industrial process control. Environments like these require electronics designed and manufactured specifically to withstand such temperature extremes.

With over 50 years experience in custom design and manufacturing of microelectronics, Vectron encompasses a blend of harsh environment electronic design and packaging expertise not common in the industry today. Our staff are experts in Hybrid Multi-Chip Modules, High Temperature and Harsh Environment Electronics for Deep Space to Deep Earth applications, Wafer Level Packaging, Physical Design Modeling, Finite Element Analysis, RF/signal conditioning, oscillator and digital embedded system designs.



Technology and Capabilities...

Facilities
State-of-the-art, high volume ceramic package and hybrid facility.

Technical Capabilities
High Temperature Electronic Packaging (-55°C to 250°C).

Package Selection
Microelectronic circuits and components that are exposed to harsh environments require hermetic packaging.

Assembly Process
Using robust assembly techniques, Vectron offers the flexibility of applying a wide range of manufacturing processes to meet the customer’s unique application requirements and ensure the delivery of the highest quality product.

Environmental Screening
Complete MIL-STD and custom harsh environment screenings are available. Vectron will work closely with customers to define screening requirements.